TGV

TGV
(Through Glass Via)

Summary

The glass etching process, essential for TGV interposer manufacturing, uses laser preprocessing to alter the density, chemical bonding state, or crystal structure, enhancing etching speed in designated areas, and improving particle management and flatness (TTV) inside the holes.

Features
  • With superior thermal conductivity compared to silicon and plastic, chips operate stably even in extreme environments.
  • Its thinness allows MLCCs to be embedded in glass substrates, increasing chip density.
  • High-strength, impact-resistant glass protects delicate electronic components and serves as a robust substrate.
  • Resistant to corrosion and damage by chemicals, the smooth surface enables microcircuit implementation.
  • It can be made larger compared to traditional substrates.
Features
In-line Process
TGV Process Flow
Process Process Process Process Process
Schematic Diagram 도식도 도식도 도식도 도식도
Elemental Technologies
  • Control of Via Hole Taper
  • Particle Management
  • Experience in Thin Glass Business
  • Etching Composition Optimizer
  • Secured Process Technology and Yield Management
  • Cleaning Process Solutions
  • Uniform Plating inside Via Hole
  • Plating Solution Management
  • Surface Roughness Control
  • Micro Polishing Technology
Application Technology
TGV (Through Glass Via)
  • This technology is used in semiconductor packaging, enabling electrical connections between layers of glass substrates or other transparent materials.
  • Typically, laser technology drills through glass substrates, creating small vertical channels filled with conductive materials like copper or silver, which is a key technology in glass interposer manufacturing.
Category Laser Etching
Top view TGV 공정 Flow TGV 공정 Flow
Section view TGV 공정 Flow TGV 공정 Flow
Interposer
  • These components are used in electronic packaging to connect different elements or technologies with varying physical properties.
  • Generally made of thin substrates, with a regular array of input/output (I/O) pads on one side and a similar array on the other, the interposer acts as a bridge between two components, allowing data or signal exchange and communication.